Characteristics: 1) The bubble can create a good effect of cushioning . 2) It has already become a mature packing material. 3) The air bubbles can prevent products from damages due to collision, attrition or static. 4) It is mainly used for the packaging of electronic component and PC boards. 5) The surface resistance is :108-1011Ω.    6)  It’s structure, size and color could all be customized.    Use area: It's usually applies to pack light  products and the products don't need high standard in packaging. Prevent damage due to shock, pressure, collision, attrition and static. Specifications: No Item Test Result 1 Heat Seal Temperature 250-375℉ 2 Heat Seal Time 0.5-3.5S 3 Heat Seal Pressure 30-70P.S.I 4 MFR ≥3.0g/min 5 Volatiles ≤0.50% 6 Material LDPE 7 Melt index (g/10min) 2.1 GB3682 8 Density(g/cm) 0.92g/cm  GB1033 9 Water absorption 0.50% 10 Outer Surface Resistance 108-11Ω 11 Tolerance length±5mm;width:±5mm GB/96-04-10 12 Appearance No delamination ,No burst Seal, No Wrinkle, No Wrap, No Break, No other dep